Intel Tolapai SOC to go against Via CoreFusion and AMD Geode.

With some small changes, this could impact ultra mobile PC designs.

Intel have announced Tolapai, an integrated CPU, North and Southbridge similar to the AMD Geode and VIA CoreFusion packages.  The information from HKEPC indicates that its targeting small embedded solutions but looking at the power requirements and the lack of any built-in VGA support, we doubt this version will have much impact in the ultra mobile PC market.

Here’s a schematic.

Click to enlarge. Source: HKEPC.

It is an indication that Intel is only one step away from having a variant of this which integrates the GPU and if they improve the power requirements (Tolapai uses only ‘Low Power’ Pentium rather than ‘Ultra Low Power’ Pentium chip design) it will be possible to use this in smaller ultra mobile PC designs. 

Tolapai is due for shipping late 2007 and its one to watch out for along with VIA ‘John’ CoreFusion and the new AMD Geode LX900.

Thanks to Arqion for the tip.